EDA Tech Forum Journal—the premier EDA publication

EDA Tech Forum journal is a quarterly publication for the Electronics Design Automation community including design engineers, engineering managers, industry executives, and academia. EDA Tech Forum journal provides an ongoing medium in which to discuss, debate, and communicate the electronic design automation industry’s most pressing issues, challenges, methodologies, problem-solving techniques, and trends.

Current Issue

<Tech Forum>

Embedded

Using Open Virtual Platforms to build, simulate and debug multiprocessor SoCs

Using Open Virtual Platforms to build, simulate and debug multiprocessor SoCs

The Open Virtual Platforms (OVP) initiative aims to help resolve the diffi culties that arise today when modeling multicore systems-on-chip (SoC) so that designers can perform early and timely test of the embedded software that will run on the end devices.

ESL/System C

Making the move to ESL hardware design

Making the move to ESL hardware design

This paper illustrates that increasing maturity by describing a system level-to-RTL design flow. It looks at the issues involved in switching to ESL hardware design and provides insights into some of the appropriate design and verifi cation tools.

Verified RTL to gates

VHDL moves toward 4.0

VHDL moves toward 4.0

Version 4.0 of the VHSIC Hardware Design Language was approved by Accellera and passed to the IEEE to begin its formal standards balloting process earlier this year.

Digital/analog implementation

Sensium: A 1V micropower SoC for vital-sign monitoring

Sensium: A 1V micropower SoC for vital-sign monitoring

This paper describes the main design components and methodology priorities for development of the Sensium system-on-chip for wireless body sensor networks. The device is targeted at vital-sign monitoring and related medical applications.

Design to silicon

Migration of the Cell Broadband Engine to 45nm SOI

Migration of the Cell Broadband Engine to 45nm SOI

The paper describes some of the main challenges in the latest process shrink for the Cell Broadband Engine, developed jointly by IBM, Sony and Toshiba.

Design to silicon

Multi-corner multi-mode signal integrity optimization

Multi-corner multi-mode signal integrity optimization

Signal integrity (SI) is an ever-growing problem as more interconnect effects and fast clocks increase the chances of crosstalk noise and glitches as well as unexpected signal delays.

Tested component to system

Implementing an intelligent solar tracking control system on an FPGA

Implementing an intelligent solar tracking control system on an FPGA

This article describes an FPGA implementation of a solar tracking control system that improves the effi ciency of solar panels by allowing them to follow the movement of the sun and maintain an optimal position perpendicular to it.

<Commentary>

Analysis

Start Here

Start Here

Questions and -- thankfully -- answers for 2007.

Analysis

Systems design automation for real

Systems design automation for real

Design Automation and Test in Europe is now the world’s leading ESL conference, says Ju?rgen Haase of edacentrum

Conference preview

Accentuate the practical

Accentuate the practical

2008’s Design Automation Conference takes its cue from engineers’ day-to-day need, says chair Limor Fix

Interview

Intel takes a new path from A to D

Intel takes a new path from A to D

CTO and DAC keynoter Justin Rattner discusses his company’s research into replacing analog circuitry with digital

Standards

STIX to the task

STIX to the task

A common test equipment interface could be worth millions to the chip industry, explains Keith Imai of the Semiconductor Test Consortium

 
©2006 EDA Tech Forum | Privacy Policy