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EDA Tech Forum journal is a quarterly publication for the Electronics Design Automation community including design engineers, engineering managers, industry executives, and academia. EDA Tech Forum journal provides an ongoing medium in which to discuss, debate, and communicate the electronic design automation industry’s most pressing issues, challenges, methodologies, problem-solving techniques, and trends.

Deploying the right tools for mixed signal verification

The article uses a case study of a Voice-over-Internet Protocol WLAN system-on-chip to analyze efficient approaches to mixed signal design verification.

undefinedGeoffrey Ying is a marketing director in the Silicon Engineering Group at Synopsys. He is responsible for product marketing activities for mixed-signal simulation products. Ying holds a BSEE from the University of Wisconsin-Madison, an MSEE and MBA from Santa Clara University.

Engineers on the leading edge of nanometer design are dealing with physical effects that change the way mixed-signal ICs are verified - in timing, power, reliability and yield. With the IC verification effort accounting for 60-80% of the development cycle, choosing and deploying the right mixed-signal verification solution can significantly improve productivity and the return on investment.

Using a system-on-chip (SoC), VoIP over WLAN, design as a case study, this article will describe and compare different verification approaches to identify the nanometer effects in the design, ranging across transistor-level circuit simulation and co-simulation with a digital simulator, as well as the use of mixed-signal behavioral languages.

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