EDA Tech Forum Journal—the premier EDA publicationEDA Tech Forum journal is a quarterly publication for the Electronics Design Automation community including design engineers, engineering managers, industry executives, and academia. EDA Tech Forum journal provides an ongoing medium in which to discuss, debate, and communicate the electronic design automation industry’s most pressing issues, challenges, methodologies, problem-solving techniques, and trends. |
New dimensions in performance
IBM currently has the market edge in developing 3D chip architectures. EDA Tech Forum gets the why, how and when from Big Blue’s Kerry Bernstein Kerry Bernstein When Kerry Bernstein, a 28-year IBM veteran, was first drafted to work on Big Blue’s development of 3D semiconductors, he admits he was a skeptic. “At first, I think I felt as though I’d got dragged into this program. I thought it wasn’t going anywhere. I thought it was going to go anywhere. But the more I’ve seen of it, the more my opinion has turned around,” he says. “Now, I think this technology is going to become pervasive.”. Indeed, Bernstein, a member of the senior technical staff at IBM’s Thomas J. Watson Research Center, has had such a change of view that he is now one of the men his company sends to events like IEDM and DAC to explain the what and why of 3D to the broader industry. To view the rest of the article, login or register below New users, register to access all online articles and archives:To register for access to online articles and archives, simply fill out the fields below. Fields marked with
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