EDA Tech Forum Journal—the premier EDA publicationEDA Tech Forum journal is a quarterly publication for the Electronics Design Automation community including design engineers, engineering managers, industry executives, and academia. EDA Tech Forum journal provides an ongoing medium in which to discuss, debate, and communicate the electronic design automation industry’s most pressing issues, challenges, methodologies, problem-solving techniques, and trends. |
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The paper describes some of the main challenges in the latest process shrink for the Cell Broadband Engine, developed jointly by IBM, Sony and Toshiba. The authors show how the move from a 65nm to a 45nm SOI process was achieved by concentrating on four primary goals:
The extensive use of IBM’s in-house developed tool, Migration Assistant Shape Handler, is also described. To view the rest of the article, login or register below Existing users:New users, register to access all online articles and archives:To register for access to online articles and archives, simply fill out the fields below. Fields marked with
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