EDA Tech Forum Journal—the premier EDA publicationEDA Tech Forum journal is a quarterly publication for the Electronics Design Automation community including design engineers, engineering managers, industry executives, and academia. EDA Tech Forum journal provides an ongoing medium in which to discuss, debate, and communicate the electronic design automation industry’s most pressing issues, challenges, methodologies, problem-solving techniques, and trends. |
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This paper describes the main design components and methodology priorities for development of the Sensium system-on-chip for wireless body sensor networks. The device is targeted at vital-sign monitoring and related medical applications. The SoC integrates an ultra-low-power wireless ISM band transceiver, hardware MAC, microprocessor, I/O peripherals, memories, 10b delta-sigma, analog-to-digital converter and custom interfaces. The chip is implemented in 0.13 um CMOS and has a 16 mm2 footprint. It operates from supply voltages as low as 0.9V and is part of a fully disposable body patch for use in ‘last meter’ (also sometimes ‘first meter’) body area networks. To view the rest of the article, login or register below Existing users:New users, register to access all online articles and archives:To register for access to online articles and archives, simply fill out the fields below. Fields marked with
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